[et_pb_section fb_built=”1″ _builder_version=”4.24.2″ _module_preset=”default” custom_css_free_form=”@media (max-width: 375px) {|| .et-db #et-boc .et-l .et_pb_post_content_0_tb_body {|| width:100% !important;|| }}” locked=”off” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” custom_padding=”2em||0px||false|false” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_heading title=”Transition from Manual and Mechanical Controls to Electronic Precision and Automation” _builder_version=”4.27.4″ _module_preset=”default” custom_css_free_form=”selector h1 {|| text-wrap: pretty;||}” global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_image src=”https:\/\/www.alicat.com\/wp-content\/uploads\/2023\/10\/article-pvdcoatings-sputtering.webp” align=”center” force_fullwidth=”on” _builder_version=”4.27.5″ _module_preset=”default” custom_margin=”1.5rem||||false|false” hover_enabled=”0″ custom_css_free_form=”selector img {|| object-fit: cover;||}” locked=”off” global_colors_info=”{}” theme_builder_area=”post_content” module_id=”article-hero-image” sticky_enabled=”0″][\/et_pb_image][et_pb_divider color=”#2A3B47″ divider_weight=”2.5px” _builder_version=”4.27.4″ _module_preset=”default” height=”0px” custom_margin=”3rem||3rem||true|false” global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_divider][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” custom_padding=”0px||0px||true|false” locked=”off” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||2rem||false|false” global_colors_info=”{}” theme_builder_area=”post_content”]<\/p>\n
PVD coating techniques use physical processes to deposit thin films on surfaces. These films offer an extremely convenient way to obtain desirable surface characteristics without having to completely change the material of a product. The layers can be as thin as only thousandths of a nanometer and can transform all types of surfaces to resist corrosion, decrease friction, increase hardness, and much more.<\/p>\n
In this article, we will explore the two most common methods of physical vapor deposition used to apply PVD coatings, thermal evaporation and sputtering deposition.<\/p>\n
[\/et_pb_text][et_pb_heading title=”PVD method 1: Thermal evaporation” _builder_version=”4.27.4″ _module_preset=”default” title_level=”h3″ global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_font_size=”16px” text_line_height=”1.8em” header_font=”|300|||||||” header_text_color=”#E12028″ header_font_size=”34px” header_2_font_size=”1.63rem” header_2_letter_spacing=”0.7px” header_2_line_height=”1.2em” header_4_font_size=”19px” custom_margin=”||2rem||false|false” custom_padding=”||||false|false” header_font_size_tablet=”34px” header_font_size_phone=”26px” header_font_size_last_edited=”on|phone” header_2_font_size_tablet=”1.63rem” header_2_font_size_phone=”20px” header_2_font_size_last_edited=”on|phone” custom_css_free_form=”selector li {|| margin-bottom: .75em;||}||||selector ul {|| padding-bottom: 0 !important;||}” global_colors_info=”{}” theme_builder_area=”post_content”]Thermal energy is used to vaporize the target material so it can be used to deposit thin film onto the substrate. Deposited materials may include pure metals, non\u2011metals, oxides, and nitrides. This process offers a high level of control over film properties like thickness, adhesion, stress, and grain structure. Compared to other PVD and CVD techniques<\/a>, thermal evaporation has one of the highest deposition rates.<\/p>\n A typical thermal evaporation system consists of the following components:<\/p>\n Thermal evaporation requires a very high vacuum of about (1\u00d710-6<\/sup> to 1\u00d710-9<\/sup> Torr). The required vacuum level depends on purity needs and the required mean free path. While differing in some specifics such as level of vacuum, the following three steps are common to all thermal evaporation setups:<\/p>\n Thermal evaporation also has subtypes, differentiated by method of vaporizing the target material. Methods include molecular beam epitaxy (MBE), electron beam deposition, flash evaporation and resistive evaporation.<\/p>\n Thermal evaporation is most often used to deposit electrically conductive metallic layers on solar cells, OLED displays and thin\u2011film transistors. It is also used in the manufacturing process of aluminum PET films.[\/et_pb_text][et_pb_heading title=”PVD method 2: Sputtering deposition” _builder_version=”4.27.4″ _module_preset=”default” title_level=”h3″ global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||2rem||false|false” global_colors_info=”{}” theme_builder_area=”post_content”]<\/p>\n Sputtering deposition is a line of sight process like thermal evaporation, however it uses energized gas molecules to deposit thin films on the substrate and provides better step coverage. This method can be used to deposit metals, non\u2011metals, alloys, and oxides.<\/p>\n A typical sputtering system consists of the following components:<\/p>\n Sputtering is performed at relatively low vacuums of 0\u00a0\u2013\u00a00.03 Torr and argon is the most commonly used gas due to its high molecular weight. The three basic steps of sputtering deposition follow:<\/p>\n Different sputtering processes like radio frequency, DC, pulsed DC, and magnetron sputtering are categorized based on the type of power supply used. A special technique called reactive sputtering is used to when depositing chemical compounds.<\/p>\n The earliest sputtering application is the production of computer hard disks. Sputtering is now used extensively in integrated circuit processing, production of anti\u2011reflective or high emissivity film coated glass, cutting tool coatings, and coating of CDs and DVDs.<\/p>\n [\/et_pb_text][et_pb_heading title=”Improving pressure control in your deposition setup” _builder_version=”4.27.4″ _module_preset=”default” title_level=”h3″ global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||2rem||false|false” global_colors_info=”{}” theme_builder_area=”post_content”]<\/p>\n\n
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Thermal evaporation methods<\/h4>\n
Common applications<\/h4>\n
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Sputtering methods<\/h4>\n
Common applications<\/h4>\n