{"id":38432,"date":"2024-03-26T16:46:23","date_gmt":"2024-03-26T16:46:23","guid":{"rendered":"https:\/\/www.alicat.com\/?post_type=article&p=38432"},"modified":"2025-06-18T20:50:34","modified_gmt":"2025-06-18T20:50:34","slug":"inchfab-eine-fallstudie-uber-fertigungssysteme-im-nanomasstab","status":"publish","type":"post","link":"https:\/\/www.alicat.com\/de\/articles\/inchfab-a-case-study-on-nanoscale-fabrication-systems\/","title":{"rendered":"Inchfab integriert Alicat Massendurchfluss- und Druckregelung in Nanoscale-Fertigungssysteme"},"content":{"rendered":"

[et_pb_section fb_built=”1″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” custom_padding=”2em||0px||false|false” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_heading title=”Inchfab Uses Mass Flow and Pressure Control in Nanoscale Fabrication Systems” _builder_version=”4.27.4″ _module_preset=”default” custom_css_free_form=”selector h1 {|| text-wrap: pretty;||}” global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_image src=”https:\/\/www.alicat.com\/wp-content\/uploads\/2024\/03\/article-inchfab-casestudy.webp” align=”center” force_fullwidth=”on” _builder_version=”4.27.4″ _module_preset=”default” max_height=”450px” custom_margin=”1.5rem||||false|false” custom_css_free_form=”selector img {|| object-fit: cover;||}” locked=”off” global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_image][et_pb_divider color=”#2A3B47″ divider_weight=”2.5px” _builder_version=”4.27.4″ _module_preset=”default” height=”0px” custom_margin=”3rem||3rem||true|false” custom_margin_tablet=”3rem||3rem||true|false” custom_margin_phone=”2rem||2rem||true|false” custom_margin_last_edited=”on|phone” global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_divider][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” custom_padding=”0px||0px||true|false” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_heading title=”Background: Nanoscale fabrication systems & Inchfab” _builder_version=”4.27.4″ _module_preset=”default” title_level=”h3″ global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” max_width=”50%” max_width_tablet=”50%” max_width_phone=”100%” max_width_last_edited=”on|phone” module_alignment=”center” custom_margin=”8px||0px||false|false” custom_padding=”||2rem|2rem|false|false” custom_padding_tablet=”|||2rem|false|false” custom_padding_phone=”||2rem|0rem|false|false” custom_padding_last_edited=”on|phone” custom_css_main_element=”float: right;” custom_css_free_form=”selector figure {|| text-align: center;||}||||selector img {|| margin-bottom: 1rem;||}” global_colors_info=”{}” custom_css_main_element_tablet=”float: right;” custom_css_main_element_phone=”float: none;” custom_css_main_element_last_edited=”on|phone” theme_builder_area=”post_content”]<\/p>\n

\"Inchfab<\/p>
Figure 1. Prototype Inchfab ICP-CVD system<\/figcaption><\/figure>\n

[\/et_pb_text][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||2rem||false|false” global_colors_info=”{}” theme_builder_area=”post_content”]<\/p>\n

The increasing demand for computing power over the past 60+ years has led to exponential increases in both device complexity and production volumes. To keep up with this demand, the latest advances in micro- and nanofabrication technology have become inextricably coupled with increasingly larger substrate sizes. This has led to some of the most awe\u2011inspiring engineering feats in history.<\/p>\n

Not surprisingly, accomplishing such feats has neither been cheap nor easy. The capital cost of modern nanoscale fabrication facilities (\u201cfabs\u201d) now routinely stretches well into the billions of USD and requires strict process controls that severely limit the types of devices that a single fab can create. The high cost and minimal flexibility of nanoscale fabrication has become a major barrier in many different markets for groups seeking to develop innovative devices.<\/p>\n

Inchfab\u2019s novel platform of ultra\u2011low\u2011cost, high\u2011performance fabrication tools is tearing down that barrier by decoupling advanced processing capabilities from large substrate sizes. By stepping back from the 150\u00a0\u2013\u00a0300 mm (\u22481 foot) diameter substrates commonly used in high\u2011volume production today, the capital cost and physical footprint of the tools and facilities needed for nanoscale fabrication can be decreased by orders of magnitude, radically increasing their accessibility. Additionally, Inchfab has demonstrated that the use of smaller substrates can also lead to performance improvements over existing commercial tools. See their prototype ICP\u2011CVD system in Figure 1.<\/p>\n

[\/et_pb_text][et_pb_heading title=”Challenge 1: Repeatable, uniform mass flow control” _builder_version=”4.27.4″ _module_preset=”default” title_level=”h3″ global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||2rem||false|false” global_colors_info=”{}” theme_builder_area=”post_content”]<\/p>\n

Two of the most important characteristics required of micro- and nanofabrication systems are run\u2011to\u2011run repeatability and spatial uniformity. Achieving high levels of repeatability and uniformity relies on the ability to control many different process inputs and environmental conditions. Among the most important of these are mass flow rates and process pressures.<\/p>\n

[\/et_pb_text][et_pb_heading title=”Solution: Laminar differential pressure mass flow control” _builder_version=”4.27.4″ _module_preset=”default” title_level=”h3″ global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”8px||2rem||false|false” custom_css_free_form=”selector figure {|| text-align: center;||}||||selector img {|| margin-bottom: 1rem;||}” global_colors_info=”{}” theme_builder_area=”post_content”]<\/p>\n

\"Inchfab<\/p>
Figure 2. Block diagram showing how the Alicat controllers are used in the Inchfab ICP\u2011CVD system.<\/figcaption><\/figure>\n

[\/et_pb_text][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||2rem||false|false” hover_enabled=”0″ global_colors_info=”{}” theme_builder_area=”post_content” sticky_enabled=”0″]Inchfab needed an affordable mass flow solution with fast response times, wide operating ranges, and no warm\u2011up times. They ended up choosing Alicat mass flow controllers (MFCs), primarily due to the benefits stemming from their laminar differential pressure\u2011based operating principle<\/a>. These controllers provided Inchfab with high\u2011accuracy measurements to 0.6% of reading, 30 ms response times, a control range of 0.01 to 100% of full scale, and no warm\u2011up times. Figure 2 shows how Alicat MFCs are connected in Inchfab\u2019s ICP-CVD system.[\/et_pb_text][et_pb_heading title=”Challenge 2: Repeatable, uniform substrate temperature profiles” _builder_version=”4.27.4″ _module_preset=”default” title_level=”h3″ global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||2rem||false|false” global_colors_info=”{}” theme_builder_area=”post_content”]<\/p>\n

Just like reliable mass flow rates, repeatable and uniform substrate temperature profiles are also essential for consistent and uniform deposition and etch profiles. For example, in plasma\u2011based etching, excess substrate heat is generated largely from bombardment from energetic particles generated in the plasma discharge and exothermic chemical reactions on the substrate surface. For fluorine\u2011based silicon etching, as the substrate temperature increases, the etch rate decreases and commonly used masking materials like photoresist can begin to erode, decreasing selectivity. To counteract this heating, heat exchangers are used to conduct heat away from the substrate. Because the substrates being processed may have delicate features on their backside, direct thermal contact with the chuck assembly is not advisable. Thus an effective solution is to introduce a layer of heat\u2011conducting gas between the substrate and the chuck.<\/p>\n

[\/et_pb_text][et_pb_heading title=”Solution: Integrated vacuum pressure control” _builder_version=”4.27.4″ _module_preset=”default” title_level=”h3″ global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”8px||2rem||false|false” custom_css_free_form=”selector figure {|| text-align: center;||}||||selector img {|| margin-bottom: 1rem;||}” global_colors_info=”{}” theme_builder_area=”post_content”]<\/p>\n

\"Alicat<\/p>
Figure 3. Alicat IVC\u2011Series pressure controller with additional manifold for substrate heat transfer<\/figcaption><\/figure>\n

[\/et_pb_text][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||2rem||false|false” global_colors_info=”{}” theme_builder_area=”post_content”]<\/p>\n

To improve heat transfer between chuck assemblies and the substrates being processed, Inchfab used an Alicat IVC\u2011Series pressure controller<\/a> (see Figure 3). This pressure controller maintained sub\u2011atmospheric gas pressures (typically 5\u00a0\u2013\u00a020 torr, depending on the process) on the backside of the substrate, minimizing the time needed to reach thermal equilibrium with the chuck assembly and maintaining equilibrium throughout processing.<\/p>\n

The vacuum sensor in the IVC pressure controller provided precise, gas\u2011independent pressure measurement in the substrate\u2011chuck layer, with the ability to be routed independently of the fluid outlet. Inchfab was able to replace a more expensive controller with this device and removed several extra pieces of control hardware due to a common digital interface between the IVC and the MFCs. They were also able to use the standard intuitive Alicat digital communications protocol, making it very simple to monitor the pressure and update setpoints whenever needed. Figure 2 shows how the IVC (labeled Alicat conductor) is integrated into Inchfab\u2019s ICP\u2011CVD system.<\/p>\n

[\/et_pb_text][et_pb_heading title=”Conclusion” _builder_version=”4.27.4″ _module_preset=”default” title_level=”h3″ global_colors_info=”{}” theme_builder_area=”post_content”][\/et_pb_heading][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” module_alignment=”center” custom_margin=”8px||2rem||false|false” custom_padding=”|2rem|||false|false” custom_padding_tablet=”|2rem|||false|false” custom_padding_phone=”|0rem|||false|false” custom_padding_last_edited=”on|phone” custom_css_main_element=”float: left;” custom_css_free_form=”selector figure {|| text-align: center;||}||||selector img {|| margin-bottom: 1rem;||}” global_colors_info=”{}” custom_css_main_element_phone=”float: none;” custom_css_main_element_last_edited=”on|phone” custom_css_main_element_tablet=”float: left;” theme_builder_area=”post_content”]<\/p>\n

\"Founders<\/p>
Mitchell Hsing and Parker Gould, co-founders of Inchfab<\/figcaption><\/figure>\n

[\/et_pb_text][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}” theme_builder_area=”post_content”]As a member of the Activate – Cyclotron Road program at Berkeley National Lab, Inchfab is working with its partners to provide innovative and economical fabrication solutions for the micro- and nanoscale device community. Inchfab continually strives to refine and expand its micro- and nanofabrication capabilities and continuously looks for new technology that can assist in that effort.[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” custom_padding=”0px||0px||true|false” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}” theme_builder_area=”post_content”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||2rem||false|false” global_colors_info=”{}” theme_builder_area=”post_content”]<\/p>\n

Cowritten by Alicat; Mitchell Hsing, Ph.D., CEO & Co\u2011Founder of Inchfab; and Parker Gould, Ph.D., CTO & Co\u2011Founder of Inchfab<\/span><\/p>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":"

Figure 1. Prototype Inchfab ICP-CVD system The increasing demand for computing power over the past 60+ years has led to exponential increases in both device complexity and production volumes. To keep up with this demand, the latest advances in micro- and nanofabrication technology have become inextricably coupled with increasingly larger substrate sizes. This has led […]<\/p>\n","protected":false},"author":24,"featured_media":44412,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"1920","content-type":"","_searchwp_excluded":"","footnotes":""},"categories":[115,123,114],"tags":[],"class_list":["post-38432","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-mass-flow","category-oem","category-pressure"],"acf":[],"yoast_head":"\nInchfab Integrates Alicat Mass Flow and Pressure Control in Nanoscale Fabrication Systems - Alicat Scientific<\/title>\n<meta name=\"description\" content=\"Inchfab integrated our mass flow and pressure controllers into their nanoscale fabrication systems. 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